We are known for our innovation based on experience

In FIDES ELECTRONICA SL you will find an experienced partner for any project. Our team, composed of engineers and qualified staff, creates innovative solutions specific to your business. The professional services, precise and customer focused we offer are a reflection of our philosophy.

 

Distinctive features of FIDES ELECTRONICA SL


• Advice on a wide range of projects
• Specialized technical and economic knowledge applied to all phases of the project
• Structure agile and fast reaction time
• Design and production of your product

 

Are you interested?
To arrange an interview with us please call +34 697 912 021

 

Meet our Engineering

Meet our productive plant

MPM Accuflex

The AccuFlex delivers all the features required for moderate volume / high mix printing,. The AccuFlex is accuracy and flexibility in a compact footprint. It delivers clear value by providing only what's required for efficient, precise printing, while permitting the user to select from a full range of options to expand capabilities to meet current and future needs.

 

 

 

 

 

Features :
6 sigma accuracy ensures precise and repeatable printing capability

11 second cycle time enhances line productivity

Large board capacity maximizes product flexibility: up to 23 x 20 in. (584 x 508 mm)

Automated product changeover capability increases production line uptime

The UltraWiper Under-Stencil Cleaning system provides unassisted cleaning of the bottom-side of the stencil using lint-free paper.

 

Philips AX5

The true parallel placement concept of the A-Series optimizes control of every placement to give the industry's highest first pass yield. Within one frame, 20 individual robots – each placing one component at a time – can easily and smoothly place 6,000 components an hour.

 

 

 

 

 

 

Features:
Smooth machine movements by design
Fully software controlled servo driven Pick & Place cycle

Constant component monitoring from pick to place by on-the-fly laser and vacuum sensing
Full placement force control for all components from 01005 up – without compromising output
Single-digit defects per million placement performance
Below 40-micron placement accuracy thanks to high resolution laser alignment, even guaranteeing that accuracy for the smallest (01005) components.

 

Opal X-II + LCS

The Opal-XII accommodates up to 100 8mm tape feeders, and delivers comprehensive component handling technology through a choice of vision systems. With a 45mm line array camera as standard and optional area CCD cameras, the new machine handles placement of components from 0201 to 45 by 45mm BGA, flip-chips, CSP, connectors and odd form SMDs.

 

 

 

 

 

Features :
Places at up to 11.6k cph with 40-micron accuracy (QFPs)

Handles components from 01005 to large connectors (45mm x 100mm)

Fine-pitch QFP, BGA, BGA and CSP packages, and components up to 11mm tall

Holds up to 100 RFID-enabled smart feeders including stick and bulk parts

The high-precision single-placement beam carries four or eight independent standard heads (SF)

Optimal output per hour - 11.6k

IPC 9850 output per hour - 9.6k

Placing accuracy at 3 sigma - 50 micron for chips, 40 micron for QFP'

Component range - 01005 (0402) to 45 x 100mm.


Electrovert Omniflex 7

The OmniFlo series machine is a forced air convection reflow soldering system consisting of blowers, heaters, a computer software control system, and a conveyor. The OmniFlo system uses heated high pressure air or optional nitrogen gas to heat the printed circuit boards as they travel through the machine on the conveyor. The pre-applied solder paste melts when the heated air is blown over and under the printed circuit board. This causes the components to be soldered into place.

 

 

 

Features :
Transport : Rails or mesh Zones : 7 + Cooling
Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" maintenance with no downtime and no change in oven PPM levels
Six-sigma reliability for the most demanding production environments
Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment.

 

Heller 1809 MK III

The 1800EXL supports high-speed, high volume throughput at speeds up to 40 inches (one meter) per minute while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The oven features an enlarged heating tunnel and baffle-free design for 25% higher airflow, for six-sigma consistency, zone-to-zone and oven-to-oven, enhanced temperature uniformity, repeatability and highload handling.

 

Features :
Transport : Rails & CBS or mesh Zones : 9 + Cooling
Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" maintenance with no downtime and no change in oven PPM levels
Six-sigma reliability for the most demanding production environments
Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment.